2018 Dieline Conference

2018 Dieline Conference

The 2018 Dieline Conference will be held April 30 - May 3 in Boston. The four-day conference will feature some of the most influential brands and package designers from across the globe.

Attendees will learn: how to maximize the power of smart package design for today's consumer; how digital printing is revolutionizing packaging; how online shopping gives new freedom and opportunities to brands by not designing packaging for retail; how to embrace the future of sustainable package design; how private label brands are thriving; the new generation of in-house design; and how new packaging technologies are enabling innovative brand experiences.

"The Dieline Conference is the go-to event for the packaging industry, whether you design packaging or branding for consumer products or work in the realm of consumer products," commented Andrew Gibbs, the founder of The Dieline Conference. "This year's conference will explore the evolution and future of brand experience. We have arrived at a moment where everything is changing, yet everything and anything is possible. The conference will show you how to embrace not only what's coming around the corner, but what might already be here."

more: howdesignlive.com (131)

The Dieline

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